To achieve this, SMARTIEHS develops an innovative measurement concept: a probing wafer consisting of an array of micro optical sensors is adapted to and aligned with the wafer under test. The design and production of the micro-optical interferometer array inspects 100 M(O)EMS structures within only one measurement cycle. A multifunctional approach of the measurement concept allows the inspection of passive and active parameters within one inspection system. A novel smart pixel detector array is developed.

SMARTIEHS provides a multifunctional design with two interferometer configurations; a low coherent interferometer and a laser interferometer. The project focuses on the measurement of shape and deformation, resonance frequency and vibration amplitude distribution. The SMARTIEHS technology will be validated and demonstrated with industrial end users. The work in SMARTIEHS will be organised in eight work packages: Project management, Inspection system design, Micro-optical interferometer system design, Micro-optical wafer production, Smart pixel camera development, inspection system integration, Inspection system test and validation, Exploitation and dissemination.