Leading to several patents and State-of-the-Art products, thermal design has been one of the focus areas of the department for over 10 years. As a consequence of increased power density, the area of thermal management has seen growing interest from both end producers of electronic equipment and from producers of cooling devices and CFD simulation tools (Computational Fluid Dynamics). Apparently, many companies seem to benefit from the easy access to previously high skill knowledge. What they don’t know is that there usually exist solutions that are simpler, smaller, less noisy and less expensive to implement which these tools does not reveal. To meet the goals of today’s products, the right thermal morphology must be included in an early design phase.  

SINTEF has in house 3D CAD design capabilities (Solid Works) enabling us to implement advanced thermal designs through optimized thermal and mechanical co-design. SINTEF are using the CFD program ICEPAK from Fluent Inc.

For more information contact: Morten Gulliksen