The group working in the field of electronic packaging covers the electrical, mechanical and thermal aspects of the electronic and microelectonic packaging design at system and chip level.

The objective of the group is to develop cost effective

The packaging group has expertise in a range of research disciplines, from materials science and ceramic engineering to mechanical engineering and microfabrication. Through its research activities, SINTEF has developed a number of innovative solutions for meeting various electronic packaging and assembly requirements for systems operating in harsh environments.